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Proceedings Paper

Electrical reliability of conductive adhesive joints: curing conditions and current density dependence
Author(s): Hyungkun Kim; Hong Zhou; S. Chungpaiboonpatana; Frank G. Shi; S. Machuga; J. Adam
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Paper Abstract

Electronic packaging is increasingly becoming a vital part of the electronics industry, representing a key barrier to cost reduction and performance improvement. Flip-chip joining using conductive polymeric adhesives have been identified as a key technologies for future electronics assembly and manufacturing. The purpose of this study is to investigate optimum conditions to achieve the best electrical performance in conductive adhesive joints. Therefore, the quality and reliability tested in conductive adhesive joints were performed at various current densities with different curing conditions. Differential scanning calorimetry and resistance measurement were used to monitor curing condition in conductive adhesives. Accelerated life testing of conductive adhesive joints made of the selected conductive adhesive using different curing conditions was performed with various current densities. The current-induced degradation of conductive adhesive joints was investigated through optical microscope and resistance measurements. Results show a shift in contact resistance depending on curing condition and current density. The contact resistance shift is found to be due to the migration of conducting particles in the adhesive joint.

Paper Details

Date Published: 23 August 2000
PDF: 9 pages
Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000); doi: 10.1117/12.410079
Show Author Affiliations
Hyungkun Kim, Univ. of California/Irvine (United States)
Hong Zhou, Univ. of California/Irvine (United States)
S. Chungpaiboonpatana, Univ. of California/Irvine (United States)
Frank G. Shi, Univ. of California/Irvine (United States)
S. Machuga, Conexant Systems Inc. (United States)
J. Adam, Conexant Systems Inc. (United States)

Published in SPIE Proceedings Vol. 4182:
Process Control and Diagnostics
Michael L. Miller; Kaihan A. Ashtiani, Editor(s)

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