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Proceedings Paper

Why single-machine processing overlay error still fails: reticle interference effect and our solution on IC foundry fab
Author(s): H. M. Sheng; Chen-Cheng Kuoe; L. G. Terng; Dong S. Cheng; Yung H. Liao; Joseph Guo
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Paper Abstract

Processing two consequent layers on the same exposure tool had long time been considered to be the terminated solution for overlay control by photolithography process engineers. Such measure would take advantage of excluding Lens distortion contribution to overlay performance and lead to only mask error, alignment accuracy, stage accuracy consume the overlay main budget. But in practice, large overlay error still could be observed even single machine run on scanner that could not be tolerable by current device requirement. How come. Reticle interference effect with alignment laser beam had been demonstrated to dominate such large overlay error contribution. Solutions to control and eliminate this effect on CI foundry fab were also presented. An advanced feedforward/feedback control system would compensate such error in advance. Also ARC coating on mask quartz side that would eliminate the interference effect will be mentioned and proved to be effective way for better overlay control performance.

Paper Details

Date Published: 23 August 2000
PDF: 9 pages
Proc. SPIE 4182, Process Control and Diagnostics, (23 August 2000); doi: 10.1117/12.410069
Show Author Affiliations
H. M. Sheng, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Chen-Cheng Kuoe, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
L. G. Terng, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Dong S. Cheng, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Yung H. Liao, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)
Joseph Guo, Taiwan Semiconductor Manufacturing Co., Ltd. (Taiwan)

Published in SPIE Proceedings Vol. 4182:
Process Control and Diagnostics
Michael L. Miller; Kaihan A. Ashtiani, Editor(s)

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