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Proceedings Paper

Progress toward high-performance infrared imaging systems-on-a-chip
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Paper Abstract

Continuing advances in CMOS technology including finer lithography, the addition of dense planarized interconnect layers, concomitant improvements in transistor performance, and the availability of design tools that facilitate large- scale circuit integration, are now enabling the development of systems on a chip. While the first such imaging systems- on-a-chip supported detection of radiation at visible wavelengths, recent imaging systems-on-a-chip extend into the infrared. The result is high-performance infrared FPAs with high functionality. We report our progress at Rockwell Science Center in exploiting submicron CMOS to produce such infrared imaging systems-on-a-chip while overcoming accompanying challenges such as lower operating voltage. Our goal is to develop third-generation infrared imagers with compelling performance and functionality advantages that not only provide high sensitivity and resolution, but also facilitate on-demand sensor selection to adeptly match each mission without need for extensive support logistics including extensive cooling and elaborate camera electronics.

Paper Details

Date Published: 15 December 2000
PDF: 9 pages
Proc. SPIE 4130, Infrared Technology and Applications XXVI, (15 December 2000); doi: 10.1117/12.409863
Show Author Affiliations
Lester J. Kozlowski, Rockwell Science Ctr. (United States)
Kadri Vural, Rockwell Science Ctr. (United States)
William E. Tennant, Rockwell Science Ctr. (United States)
William E. Kleinhans, Valley Oak Semiconductor, Inc. (United States)
Isoris S. Gergis, Rockwell Science Ctr. (United States)

Published in SPIE Proceedings Vol. 4130:
Infrared Technology and Applications XXVI
Bjorn F. Andresen; Gabor F. Fulop; Marija Strojnik, Editor(s)

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