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Proceedings Paper

Low-noise readout circuit for uncooled infrared FPA
Author(s): Akio Tanaka; Kazuhiro Chiba; Tsutomu Endoh; Kuniyuki Okuyama; Akihiro Kawahara; Kiyoshi Iida; Nanao Tsukamoto
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Paper Abstract

A low-noise architecture for uncooled microbolometer focal plane arrays is described. The on-chip readout circuit contains an integration circuit in which the bolometer current is directly injected into a capacitor, and exhibits extremely low noise with no decrease in signal. The simple configuration of the integration circuit makes it possible to operate more circuits in parallel, and increases the integration time and number of pixels. The bias circuit for the integration circuit is formed on the chip to reduce the effect of changes in the substrate temperature. The equivalent input noise, in which all readout noise is converted into that at the bolometer node, was 6.2(mu) V rms. A noise at this level is so low that can loosen the required TCR in the bolometer material. A 37-micrometers -pitch 320 x 240 ROIC was fabricated, and its expected NETD was 67-34 mK at a TCR of 1-2%/K. This architecture makes it possible to produce low-cost miniature cameras.

Paper Details

Date Published: 15 December 2000
PDF: 8 pages
Proc. SPIE 4130, Infrared Technology and Applications XXVI, (15 December 2000); doi: 10.1117/12.409858
Show Author Affiliations
Akio Tanaka, NEC Corp. (Japan)
Kazuhiro Chiba, NEC Corp. (Japan)
Tsutomu Endoh, NEC Corp. (Japan)
Kuniyuki Okuyama, NEC Corp. (Japan)
Akihiro Kawahara, NEC Corp. (Japan)
Kiyoshi Iida, NEC Corp. (Japan)
Nanao Tsukamoto, NEC Aerospace Systems, Ltd. (Japan)

Published in SPIE Proceedings Vol. 4130:
Infrared Technology and Applications XXVI
Bjorn F. Andresen; Gabor F. Fulop; Marija Strojnik, Editor(s)

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