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Proceedings Paper

Free-space micro-optical intra-MCM interconnection modules: performances, potentialities, and limitations
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Paper Abstract

We design and realize a scalable multi-channel free-space interconnection prototype with the potential for Tb/s.cm2 aggregate bit rate capacity over inter- and intra-MCM interconnection distances. The component is prototyped in a high quality optical plastic, PMMA, using deep lithography with protons. At present data communication is achieved at 622 Mb/s per channel with a BER smaller than 10-13 for the 16 channels with inter-channel cross-talks as low as -22dB. We perform a sensitivity analysis for misalignments and study the impact of fabrication errors on the performance of the interconnection module in case injection moulding would be the preferred mass-fabrication technique. We provide evidence that these modules can be mass-fabricated with the required precision in optical plastics suited for heterogeneous integration with semiconductor materials.

Paper Details

Date Published: 17 November 2000
PDF: 9 pages
Proc. SPIE 4109, Critical Technologies for the Future of Computing, (17 November 2000); doi: 10.1117/12.409224
Show Author Affiliations
Valerie Baukens, Vrije Univ. Brussel (Belgium)
Christof Debaes, Vrije Univ. Brussel (Belgium)
Michael Vervaeke, Vrije Univ. Brussel (Belgium)
Heidi Ottevaere, Vrije Univ. Brussel (Belgium)
Bart Volckaerts, Vrije Univ. Brussel (Belgium)
Pedro Vynck, Vrije Univ. Brussel (Belgium)
Patrik Tuteleers, Vrije Univ. Brussel (Belgium)
Alex Hermanne, Vrije Univ. Brussel (Belgium)
Jan M. Van Campenhout, Univ. of Ghent (Belgium)
Mike Hanney, CTP-COIL (United Kingdom)
Irina P. Veretennicoff, Vrije Univ. Brussel (Belgium)
Hugo Thienpont, Vrije Univ. Brussel (Belgium)


Published in SPIE Proceedings Vol. 4109:
Critical Technologies for the Future of Computing
Sunny Bains; Leo J. Irakliotis, Editor(s)

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