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Proceedings Paper

PMMA deep etching by O2RIE
Author(s): Aibin Yu; Guifu Ding; Xiaoyun Guo; Changmin Li; Haiping Mao; Zhiping Ni
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Paper Abstract

The microstructures that have relatively large height, high aspect ratio are very important for improving micro-devices' characteristics. In this paper reactive ion etching (RIE) of PMMA to create high aspect ratio micro-structures was described. We use Ni film as mask, which was patterned by usual photochemical etching, then use O2RIE technology to etch PMMA thick film (100 micrometers ). During the etching process, O2 pressure, etching power are very important for the etching results. There are grass-like residues remained on the etched surface until the PMMA was over etched, this phenomena is caused by the micro-mask effect. With over etched, the grass-like residues can be eliminated. The etched surface is very smooth and the side wall is vertical. The etching depth can get up to higher than 100 (mu) M and the aspect ratio is 5.

Paper Details

Date Published: 29 November 2000
PDF: 4 pages
Proc. SPIE 4086, Fourth International Conference on Thin Film Physics and Applications, (29 November 2000); doi: 10.1117/12.408400
Show Author Affiliations
Aibin Yu, Shanghai Jiao Tong Univ. (China)
Guifu Ding, Shanghai Jiao Tong Univ. (China)
Xiaoyun Guo, Shanghai Jiao Tong Univ. (China)
Changmin Li, Shanghai Jiao Tong Univ. (China)
Haiping Mao, Shanghai Jiao Tong Univ. (China)
Zhiping Ni, Shanghai Jiao Tong Univ. (China)


Published in SPIE Proceedings Vol. 4086:
Fourth International Conference on Thin Film Physics and Applications
Junhao Chu; Pulin Liu; Yong Chang, Editor(s)

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