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Proceedings Paper

Applications of laser ablation to microengineering
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Paper Abstract

Applications of pulsed laser ablation to the manufacture of micro- electro-mechanical systems (MEMS) and micro-opto-electro-mechanical systems (MOEMS) devices are presented. Laser ablative processes used to manufacture a variety of microsystems technology (MST) components in the computer peripheral, sensing and biomedical industries are described together with a view of some future developments.

Paper Details

Date Published: 16 August 2000
PDF: 9 pages
Proc. SPIE 4065, High-Power Laser Ablation III, (16 August 2000); doi: 10.1117/12.407367
Show Author Affiliations
Malcolm C. Gower, Exitech Ltd. (United Kingdom)
Nadeem Hasan Rizvi, Exitech Ltd. (United Kingdom)


Published in SPIE Proceedings Vol. 4065:
High-Power Laser Ablation III
Claude R. Phipps, Editor(s)

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