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Proceedings Paper

Laser processing of siliceous materials
Author(s): Michael Panzner; Andreas Lenk; Guenter R. Wiedemann; Jan Hauptmann; Hans Juergen Weiss; Thomas Ruemenapp; Lothar Morgenthal; Eckhard Beyer
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Paper Abstract

Laser processing of siliceous materials becomes increasingly important. Analogous to the laser processing of conventional materials there are applications in the fields of cleaning, surface processing, cutting, etc. The present paper concerns the state of the art and new applications: (1) Laser cleaning of natural stone surfaces. The good disability allows restoration work to be carried out conveniently, as for example the complete removal of crusts or the removal to such degree that moisture is not trapped beneath. (2) Non-slip finish of polished natural stone surfaces: The excellent focusing of laser beams on spots as small as 100 micrometer and below can be exploited to produce macroscopically invisible structures on the surfaces of different materials. This permits microscopically small craters and lentil shaped depressions to be generated on the stone surface. Therefore it is possible to provide a non-slip finish to polished natural stone surfaces without noticeably impairing the gloss. (3) Concrete cutting: In Europe, and particularly in Germany, there is a growing demand for redevelopment of concrete apartment buildings, involving the removal of non-bearing walls and the cutting of openings. The temporal relocation of residents due to the noise and moisture from the use of diamond tools could be avoided by applying a laser cutting technology. With a 3 kW-Nd-YAG-laser, 70 mm concrete can be cut with rates up to 25 mm/min.

Paper Details

Date Published: 16 August 2000
PDF: 14 pages
Proc. SPIE 4065, High-Power Laser Ablation III, (16 August 2000); doi: 10.1117/12.407354
Show Author Affiliations
Michael Panzner, Fraunhofer Institute for Material and Beam Technology (Germany)
Andreas Lenk, Fraunhofer Institute for Material and Beam Technology (Germany)
Guenter R. Wiedemann, Fraunhofer Institute for Material and Beam Technology (Germany)
Jan Hauptmann, Fraunhofer Institute for Material and Beam Technology (Germany)
Hans Juergen Weiss, Fraunhofer Institute for Material and Beam Technology (Germany)
Thomas Ruemenapp, Fraunhofer Institute for Material and Beam Technology (Germany)
Lothar Morgenthal, Fraunhofer Institute for Material and Beam Technology (Germany)
Eckhard Beyer, Fraunhofer Institute for Material and Beam Technology (Germany)


Published in SPIE Proceedings Vol. 4065:
High-Power Laser Ablation III
Claude R. Phipps, Editor(s)

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