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Proceedings Paper

Optical microscopy at sub-0.1-um resolution for semiconductor applications
Author(s): Wolfgang Vollrath
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Paper Abstract

This paper addresses the possibilities and recent achievements in increasing significantly the resolution of optical microscopy for wafer and mask inspection and metrology. DUV microscopes operating at 248 nm wavelength already offer a feature size resolution down to 0.08 micrometers . Photon tunneling microscopy (solid immersion optics) allows to apply the higher resolution of immersion optics without bringing the immersion into contact with the specimen. First results are shown. A special illumination mode in laser confocal microscopy, the so called doughnut illumination, appears to have the potential for increasing the resolution by about 30% compared to classical laser confocal microscopy. It is shown that in the combination of these three methods an ultimate feature size resolution of about 25nm may be achieved- at least theoretically. The future will show if what seems to be physically feasible can be transformed to technical solutions.

Paper Details

Date Published: 2 November 2000
PDF: 8 pages
Proc. SPIE 4099, Optical Metrology Roadmap for the Semiconductor, Optical, and Data Storage Industries, (2 November 2000); doi: 10.1117/12.405825
Show Author Affiliations
Wolfgang Vollrath, Leica Microsystems Wetzlar GmbH (Germany)

Published in SPIE Proceedings Vol. 4099:
Optical Metrology Roadmap for the Semiconductor, Optical, and Data Storage Industries
Ghanim A. Al-Jumaily; Angela Duparre; Bhanwar Singh, Editor(s)

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