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Proceedings Paper

Technique of microfabrication suitable for machining submillimeter-wave components
Author(s): Wai Yip Liu; David Paul Steenson; Michael B. Steer
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Paper Abstract

This paper reports a novel methodology of microfabrication particularly suitable for machining sub-millimeter wave components. The proposed technique entails the use of a positive photoresist (known as EPON SU-8 tm) in realization of E-plane components, in addition to other 3-D polymer structures such as rectangular waveguides. Because the micro-structure fabricated with the said photoresist can be less than ten microns thick, a high-Q E-plane circuitry of negligible substrate thickness can be lithographically processed to attain minimal dielectric loss. On the other hand, a planar whisker can be glued onto the E-plane circuits, enabling electrical contact of the small-diameter devices to be formed. But realizing non-planar structures with parametric variation in thickness is not lithographically trivial, adding the fact that the waveguide flanges can only be machined mechanically at the time of this writing. As suck, the authors suggest that an oversized waveguide channel and standard flange interfaces be first mechanically milled onto a metal block. The components to be processed with the said photoresist are then directly fabricated onto the oversized waveguide channel, in such a way that their interfaces to other standard waveguides can be maintained without loss of geometrical accuracy. In this paper, the basic fabrication procedures are first described, with formulae given on some design criteria. Laser Direct Imaging as applied to processing of SU-8 based submillimeter wave components are discussed, with particular reference given to the technical considerations as found from our recent experimental evidence. Measurements will be given to further substantiate this presentation.

Paper Details

Date Published: 6 November 2000
PDF: 4 pages
Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); doi: 10.1117/12.405741
Show Author Affiliations
Wai Yip Liu, Univ. of Leeds (United States)
David Paul Steenson, Univ. of Leeds (United Kingdom)
Michael B. Steer, Univ. of Leeds (United States)


Published in SPIE Proceedings Vol. 4088:
First International Symposium on Laser Precision Microfabrication

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