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Proceedings Paper

Laser processing system for microdrilling of printed circuit boards
Author(s): Junichi Nishimae; Yukio Satoh; Tetsuo Kojima; Tsukasa Fukushima
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Paper Abstract

Two laser processing systems for micro drilling of printed circuit boards and/or LSI packages are presented. One is a pulsed CO2 laser system and the other is a LD-pumped THG-YAG laser system, both are now commercially available.

Paper Details

Date Published: 6 November 2000
PDF: 3 pages
Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); doi: 10.1117/12.405681
Show Author Affiliations
Junichi Nishimae, Mitsubishi Electric Corp. (Japan)
Yukio Satoh, Mitsubishi Electric Corp. (Japan)
Tetsuo Kojima, Mitsubishi Electric Corp. (Japan)
Tsukasa Fukushima, Nagoya Works/Mitsubishi Electric Corp. (Japan)


Published in SPIE Proceedings Vol. 4088:
First International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Koji Sugioka; Thomas W. Sigmon, Editor(s)

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