Share Email Print

Proceedings Paper

Laser processing system for microdrilling of printed circuit boards
Author(s): Junichi Nishimae; Yukio Satoh; Tetsuo Kojima; Tsukasa Fukushima
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Two laser processing systems for micro drilling of printed circuit boards and/or LSI packages are presented. One is a pulsed CO2 laser system and the other is a LD-pumped THG-YAG laser system, both are now commercially available.

Paper Details

Date Published: 6 November 2000
PDF: 3 pages
Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); doi: 10.1117/12.405681
Show Author Affiliations
Junichi Nishimae, Mitsubishi Electric Corp. (Japan)
Yukio Satoh, Mitsubishi Electric Corp. (Japan)
Tetsuo Kojima, Mitsubishi Electric Corp. (Japan)
Tsukasa Fukushima, Nagoya Works/Mitsubishi Electric Corp. (Japan)

Published in SPIE Proceedings Vol. 4088:
First International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Koji Sugioka; Thomas W. Sigmon, Editor(s)

© SPIE. Terms of Use
Back to Top