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Proceedings Paper

Removal process of metal thin films during laser rear patterning
Author(s): Tomokazu Sano; Isamu Miyamoto
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Paper Abstract

In laser rear patterning, a thin film deposited on the supporting substrate is irradiated by a laser beam from the rear side of the thin film through the substrate to remove the irradiated area of the film. In this study, a KrF excimer laser with a pulse width of 30 ns and different values of fluences was focused onto metal such as a gold and a copper thin films, which were deposited on a fused silica substrate using the ion sputter deposition method. The intensities of the incident and the transmitted laser beams were measured simultaneously using photodiodes during the laser rear patterning. The results show that the film removal started after approximately 10 ns of laser irradiation under optimized deposition condition. During the laser rear patterning, it was found that the recoil force of the evaporation generated between the film and the substrate pressed the film. As a result, the molten part at the edge of the unirradiated part was peeled and ejected away by the momentum from the recoil force.

Paper Details

Date Published: 6 November 2000
PDF: 4 pages
Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); doi: 10.1117/12.405679
Show Author Affiliations
Tomokazu Sano, Osaka Univ. (Japan)
Isamu Miyamoto, Osaka Univ. (Japan)


Published in SPIE Proceedings Vol. 4088:
First International Symposium on Laser Precision Microfabrication

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