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Proceedings Paper

Laser precision microfabrication in Japan
Author(s): Isamu Miyamoto; Toshihiko Ooie; Shozui Takeno
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Paper Abstract

Electronic devices such as handy phones and micro computers have been rapidly expanding their market recent years due to their enhanced performance, down sizing and cost down. This has been realized by the innovation in the precision micro- fabrication technology of semiconductors and printed wiring circuit boards (PWB) where laser technologies such as lithography, drilling, trimming, welding and soldering play an important role. In phot lithography, for instance, KrF excimer lasers having a resolution of 0.18 micrometers has been used in production instead of mercury lamp. Laser drilling of PWB has been increased up to over 1000 holes per second, and approximately 800 laser drilling systems of PWB are expected to be delivered in the world market this year, and most of these laser processing systems are manufactured in Japan. Trend of laser micro-fabrication in Japanese industry is described along with recent topics of R&D, government supported project and future tasks of industrial laser precision micro-fabrication on the basis of the survey conducted by Japan laser Processing Society.

Paper Details

Date Published: 6 November 2000
PDF: 8 pages
Proc. SPIE 4088, First International Symposium on Laser Precision Microfabrication, (6 November 2000); doi: 10.1117/12.405676
Show Author Affiliations
Isamu Miyamoto, Osaka Univ. (Japan)
Toshihiko Ooie, Shikoku National Industrial Research Institute (Japan)
Shozui Takeno, Mitsubishi Electric Corp. (Japan)


Published in SPIE Proceedings Vol. 4088:
First International Symposium on Laser Precision Microfabrication
Isamu Miyamoto; Koji Sugioka; Thomas W. Sigmon, Editor(s)

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