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Proceedings Paper

Design considerations in micromachined silicon microphones
Author(s): Jianmin Miao; Rongming Lin; Longqing Chen; Quanbo Zou; Sin Yee Lim; Suan Hee Seah
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Paper Abstract

We present and compare the different design of micromachined silicon condenser microphones. The aim is to develop the microphones with high sensitivity and low fabrication cost. Slotted and corrugated diaphragms have been designed and fabricated in order to increase the mechanical sensitivity of microphones. At the same time we developed the fabrication process for the low stress so stress-free multilayers polysilicon used as the microphone diaphragms. To increase the microphone chip density on one wafer and avoid the sticking problem during the wet release process, a new process design using deep reactive ion etching is prosed, such process system is available in our laboratory.

Paper Details

Date Published: 24 October 2000
PDF: 6 pages
Proc. SPIE 4228, Design, Modeling, and Simulation in Microelectronics, (24 October 2000); doi: 10.1117/12.405427
Show Author Affiliations
Jianmin Miao, Nanyang Technological Univ. (Singapore)
Rongming Lin, Nanyang Technological Univ. (Singapore)
Longqing Chen, Nanyang Technological Univ. (Singapore)
Quanbo Zou, Nanyang Technological Univ. (Singapore)
Sin Yee Lim, Nanyang Technological Univ. (Singapore)
Suan Hee Seah, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 4228:
Design, Modeling, and Simulation in Microelectronics
Bernard Courtois; Serge N. Demidenko; Lee Y. Lau, Editor(s)

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