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Proceedings Paper

Tuning dielectric constant and Young's modulus by nanofabrication
Author(s): Chang Qing Sun; Beng Kang Tay; Shu Ping Lau; Xiao Wei Sun
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Paper Abstract

Understanding the origin, the trend and the scale of the relative change of the mechanical strength and the dielectric properties of a nanometric solid is of great importance in designing solid-state device. Here we present a model that describes the nature and behavior of a nanosolid including spherical dots, wires and ultrathin films. Consistency between predictions and experimental observations confirms that the size-driven property-change originates from the chemical bond contraction at surface and the rise in the surface-to-volume ratio of the nanosolid. It is found that the bond contracts by as high as 14 percent and the corresponding Young's modulus increase by 100 percent at surface, and that the dielectric constant of semiconductors decreases with reducing the dimension of the solid, which leads to the blue shift in the photoluminescence and absorption edges.

Paper Details

Date Published: 24 October 2000
PDF: 7 pages
Proc. SPIE 4228, Design, Modeling, and Simulation in Microelectronics, (24 October 2000); doi: 10.1117/12.405426
Show Author Affiliations
Chang Qing Sun, Nanyang Technological Univ. (Singapore)
Beng Kang Tay, Nanyang Technological Univ. (Singapore)
Shu Ping Lau, Nanyang Technological Univ. (Singapore)
Xiao Wei Sun, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 4228:
Design, Modeling, and Simulation in Microelectronics
Bernard Courtois; Serge N. Demidenko; Lee Y. Lau, Editor(s)

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