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Proceedings Paper

From MEMS to the global simulation of SoCs
Author(s): Marta Rencz; Vladimir Szekely; Andras Poppe; Bernard Courtois
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Paper Abstract

This paper is dealing with design, simulation and test of microsystems. Both existing tools and open research areas are addressed. All through the paper, similarities between the present development of MEMS and the development of microelectronics decades ago are pointed out, including the migration from point tools to Computer-Aided Design frameworks, testing, foundries/fabless business or IP issues. Specific aspects such as thermal simulation of microstructures and thermomechanical design at the package level. The conclusion is depicting a possible global simulation scheme integrating thermomechanical design at the package level. The conclusion is depicting a possible global simulation scheme integrating the needs of Systems on Chip multi language simulation together with the needs of MEMS multipurpose simulation.

Paper Details

Date Published: 24 October 2000
PDF: 12 pages
Proc. SPIE 4228, Design, Modeling, and Simulation in Microelectronics, (24 October 2000); doi: 10.1117/12.405418
Show Author Affiliations
Marta Rencz, MicReD Ltd. (Hungary)
Vladimir Szekely, Technical Univ. of Budapest (Hungary)
Andras Poppe, Technical Univ. of Budapest (Hungary)
Bernard Courtois, TIMA Lab. (France)


Published in SPIE Proceedings Vol. 4228:
Design, Modeling, and Simulation in Microelectronics
Bernard Courtois; Serge N. Demidenko; Lee Y. Lau, Editor(s)

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