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Proceedings Paper

Importance of oxide capping on the suppression of dopant outdiffusion for salicide block process
Author(s): Hong Liao; Soh Yun Siah; David Vigar
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Paper Abstract

In this paper, the effect of dopant out diffusion on unsalicided polysilicon resistance has been intensively investigated. It has been found that excessive dopant out diffusion as a result of non-optimized oxide capping could cause a large variation in sheet resistance of the unsalicided polysilicon resistor. For this salicide block process, great attention needs to be paid for the suppression of dopant out diffusion. Based on understanding of the cause of the inconsistent, unsalicided polysilicon resistance, we demonstrate an implementation of salicide blocking for 0.25 micrometers CMOS technology with a well controlled unsalicided polysilicon resistance by exploring the various process trade-offs in the choice of oxide for the salicide blocking and optimizing the subsequent thermal annealing process.

Paper Details

Date Published: 24 October 2000
PDF: 6 pages
Proc. SPIE 4227, Advanced Microelectronic Processing Techniques, (24 October 2000); doi: 10.1117/12.405379
Show Author Affiliations
Hong Liao, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
Soh Yun Siah, Chartered Semiconductor Manufacturing, Ltd. (Singapore)
David Vigar, Chartered Semiconductor Manufacturing, Ltd. (Singapore)

Published in SPIE Proceedings Vol. 4227:
Advanced Microelectronic Processing Techniques
H. Barry Harrison; Andrew Thye Shen Wee; Subhash Gupta, Editor(s)

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