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Proceedings Paper

Laser micromachining in the microelectronics industry: a historical overview
Author(s): Edward J. Swenson; Yunlong Sun; Corey M. Dunsky
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Paper Abstract

The use of lasers in microelectronics is production for trimming, ablating, drilling and general micromachining continues to grow. As one example, traditional laser trimming techniques for passive and active microelectronic circuits have been used for nearly thirty years to improve yields and/or device performance. The majority of these processes have been accomplished using the fundamental wavelengths of the Nd:YAG laser source. However, recent technological advances in microelectronics laser processing, mainly for hybrid integrated circuits (HIC), dynamic random access memories (DRAM) and printed wiring boards (PWB) have resulted in new process techniques. Several new technologies, such as alternative wavelength processing and shaped, uniform laser spots have produced better processing quality, higher reliabiltiy, and greater yields. This paper will review the past, present and future of laser micromachining in microelectronics.

Paper Details

Date Published: 25 October 2000
PDF: 15 pages
Proc. SPIE 4095, Laser Beam Shaping, (25 October 2000); doi: 10.1117/12.405254
Show Author Affiliations
Edward J. Swenson, Electro Scientific Industries, Inc. (United States)
Yunlong Sun, Electro Scientific Industries, Inc. (United States)
Corey M. Dunsky, Electro Scientific Industries, Inc. (United States)

Published in SPIE Proceedings Vol. 4095:
Laser Beam Shaping
Fred M. Dickey; Scott C. Holswade, Editor(s)

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