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Proceedings Paper

High-frequency rf microswitches using MEMS-integrated fabrication process
Author(s): Ai Qun Liu; Geok Ing Ng; Yee Loy Lam; S. T. Chew; S. K. Ting
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Paper Abstract

Both electrical and mechanical models, exemplified with a micromachined capacitive switch with simple bridge structure, accurately describing its electrical and mechanical characteristics are described in this paper. The electrical model is represented as a RLC circuit, while the mechanical model is represented as a fixed-fixed beam. The advantage of these models is that it is possible to pre- determine various characteristics, such as the switching time of micromachinecd capacitive switches, during the design stage. These models can be used to accurately design micromachined capacitive switches for microwave applications. An illustrated fabrication process is also discussed.

Paper Details

Date Published: 20 October 2000
PDF: 9 pages
Proc. SPIE 4230, Micromachining and Microfabrication, (20 October 2000); doi: 10.1117/12.404912
Show Author Affiliations
Ai Qun Liu, Nanyang Technological Univ. (Singapore)
Geok Ing Ng, Nanyang Technological Univ. (Singapore)
Yee Loy Lam, Nanyang Technological Univ. (Singapore)
S. T. Chew, DSO National Labs. (Singapore)
S. K. Ting, Defence Science and Technology Agency (Singapore)


Published in SPIE Proceedings Vol. 4230:
Micromachining and Microfabrication
Kevin H. Chau; M. Parameswaran; Francis E.H. Tay, Editor(s)

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