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Proceedings Paper

MEMS variable capacitor for one-chip rf front end
Author(s): Seonho Seok; Chul Nam; KukJin Chun
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Paper Abstract

Area-varying tunable MEMS (MicroElectroMechanical Systems) capacitor with 608 comb fingers is developed. The 6 um-thick single crystal silicon MEMS structure is bonded to the pyrex glass substrate using the glass-silicon anodic bonding technique and chemical mechanical polish to make the designed capacitor. The pyrex glass is used as a substrate instead of the silicon for reducing the RF losses through the substrate. The measured capacitor shows the nominal capacitance of 1.4 pF, Q-factor of 4 at 1 GHz. The capacitor model is also developed and proved by Serenade software of Ansoft Corporation.

Paper Details

Date Published: 20 October 2000
PDF: 8 pages
Proc. SPIE 4230, Micromachining and Microfabrication, (20 October 2000); doi: 10.1117/12.404909
Show Author Affiliations
Seonho Seok, Seoul National Univ. (South Korea)
Chul Nam, Seoul National Univ. (South Korea)
KukJin Chun, Seoul National Univ. (South Korea)


Published in SPIE Proceedings Vol. 4230:
Micromachining and Microfabrication
Kevin H. Chau; M. Parameswaran; Francis E.H. Tay, Editor(s)

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