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Proceedings Paper

Finite element analysis and experiments of ultrafine-pitch wire bonding
Author(s): Zhaowei Zhong; Kay Soon Goh
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Paper Abstract

The demand for increased computing power and more complex IC devices with increased functions per chip results in higher I/O count packaging. With the shrinkage in IC size and the decrease in pad pitch, the trend is moving from the current fine-pitch, such as the 50micrometers and 40micrometers . Given the tight constraint, the bonding process and bonding tool design become more complex, which produces smaller bond deformation in a repeatable manner. Those problems associated with open wire, bond liftoff, surface contamination, etc., have now become more sensitive and difficult to control.

Paper Details

Date Published: 23 October 2000
PDF: 8 pages
Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404885
Show Author Affiliations
Zhaowei Zhong, Nanyang Technological Univ. (Singapore)
Kay Soon Goh, SPT Asia Pte Ltd. (Singapore)


Published in SPIE Proceedings Vol. 4229:
Microelectronic Yield, Reliability, and Advanced Packaging
Cher Ming Tan; Yeng-Kaung Peng; Mali Mahalingam; Krishnamachar Prasad, Editor(s)

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