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Proceedings Paper

Chemical imaging of microvias in flip chip pin grid array packages using time-of-flight secondary ion mass spectroscopy
Author(s): Yoon Loong Khong; Hooi Ling Lee
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Paper Abstract

Distribution of chemical species in cross sectioned micro- via were observed using the Time-of-Flight-Secondary-Ion- Mass-Spectroscopy (TOF-SIMS). The TOF-SIMS combines high molecular and elemental detection sensitivities and good lateral resolution for detection of molecular and elemental content in the micro-via and surrounding structures of the flip-chip-pin-grid array packages fabricated from several sources. The data obtained indicate that it is feasible to compare and monitor organic package fabrication processes using TOF-SIMS chemical images.

Paper Details

Date Published: 23 October 2000
PDF: 8 pages
Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404875
Show Author Affiliations
Yoon Loong Khong, Intel Technology (Malaysia)
Hooi Ling Lee, Intel Technology (Malaysia)


Published in SPIE Proceedings Vol. 4229:
Microelectronic Yield, Reliability, and Advanced Packaging
Cher Ming Tan; Yeng-Kaung Peng; Mali Mahalingam; Krishnamachar Prasad, Editor(s)

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