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Proceedings Paper

Burn-in strategy based on Weibull failures
Author(s): Wei-Ting Kary Chien; Charles H. J. Huang
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Paper Abstract

Burn-in is crucial for ICs, especially for DRAM. To meet the target failure rate after releasing the products to customers, the manufacturers have to burn-in the chips after assembly and FT for a certain period of time to weed-out the weaker parts. It is important to determine the burn-in time and to set-up a re-burn-in strategy to meet required failure rate and to maintain cost-effective at the same time. This paper introduces an innovative approach to achieve these two objectives along with some practical concerns on burn-in at field applications. The proposed methodology can be applied on versatile statistical distributions. In this presentation, the selected failure mechanisms follows Weibull distribution to illustrate our approaches.

Paper Details

Date Published: 23 October 2000
PDF: 7 pages
Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404872
Show Author Affiliations
Wei-Ting Kary Chien, Worldwide Semiconductor Manufacturing Corp. (Taiwan)
Charles H. J. Huang, Worldwide Semiconductor Manufacturing Corp. (Taiwan)


Published in SPIE Proceedings Vol. 4229:
Microelectronic Yield, Reliability, and Advanced Packaging
Cher Ming Tan; Yeng-Kaung Peng; Mali Mahalingam; Krishnamachar Prasad, Editor(s)

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