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Proceedings Paper

Measurement of thermal deformation of IC packages using the AFM scanning moire technique
Author(s): Zhaowei Zhong; Yunguang Lu; Huimin Xie; Bryan Kok Ann Ngoi; Jin Yu; Gin Boay Chai; Anand Krishna Asundi
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Paper Abstract

The scanning moire method was suggested in 1980s. A scanning moire method using optical method was proposed in 1993. The scanning lines in the SEM monitor or CCD video camera were utilized as the reference grating to form a scanning moire pattern. The available results are limited to the deformation measurement by using a grating with a frequency less than 250 lines/mm. Thus it is impossible to apply this method to measure deformation in nanometer scale. With the development of micro-mechanics and the appearance of nanometer mechanics, new techniques for deformation measurement form micrometer to nanometer scales are in urgent need.

Paper Details

Date Published: 23 October 2000
PDF: 9 pages
Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404871
Show Author Affiliations
Zhaowei Zhong, Nanyang Technological Univ. (Singapore)
Yunguang Lu, Nanyang Technological Univ. (Singapore)
Huimin Xie, Nanyang Technological Univ. (Singapore)
Bryan Kok Ann Ngoi, Nanyang Technological Univ. (Singapore)
Jin Yu, Nanyang Technological Univ. (Singapore)
Gin Boay Chai, Nanyang Technological Univ. (Singapore)
Anand Krishna Asundi, Nanyang Technological Univ. (Singapore)

Published in SPIE Proceedings Vol. 4229:
Microelectronic Yield, Reliability, and Advanced Packaging
Cher Ming Tan; Yeng-Kaung Peng; Mali Mahalingam; Krishnamachar Prasad, Editor(s)

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