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Proceedings Paper

FEA evaluation on solder joint reliability of CCGA
Author(s): Tim Fai Lam
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Paper Abstract

3D diagonal sliced models for seven combinations of CCGA packages were built. The FEA results show that, the board level reliability of package A with interposer is more than two times better than Package B without interposer. But the improvement should be mainly attributed to the bigger and longer columns used by Package A, instead of the interposer. Bigger and longer column and thicker eutectic joint improve the reliability significantly.

Paper Details

Date Published: 23 October 2000
PDF: 10 pages
Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404870
Show Author Affiliations
Tim Fai Lam, Advanced Micro Devices Pte Ltd. (Singapore)


Published in SPIE Proceedings Vol. 4229:
Microelectronic Yield, Reliability, and Advanced Packaging
Cher Ming Tan; Yeng-Kaung Peng; Mali Mahalingam; Krishnamachar Prasad, Editor(s)

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