Share Email Print
cover

Proceedings Paper

Test and reliability analysis of PBGA assemblies under random vibration
Author(s): Qingjin Yang; Zhiping Wang; Geok Hian Lim; Hock Lye John Pang; Fook Fah Yap; Rongming Lin
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

To understand the high-cycle reliability of plastic ball grid array (PBGA) interconnections under external random vibration loading, a series of vibration test of PBGA assemblies were conducted. The test vehicle has four PBGA modules assembled on a printed circuit board. The assembly was clamped at two opposite sides on a fixture, which was bolted to a vibration excitation. Firstly, the dynamic properties of the assembly under external random vibration excitation were characterized. The resonant frequencies of the assembly were identified, and the maximum dynamic deflection was estimated. Then the reliability test were carried out. In the reliability tests, the electrical resistance of PBGA modules was continuously monitored, so that any failure could be detected. This paper describes the test procedures, and shows the typical vibration fatigue failures in the PBGA interconnections. Test results will be analyzed in detail.

Paper Details

Date Published: 23 October 2000
PDF: 7 pages
Proc. SPIE 4229, Microelectronic Yield, Reliability, and Advanced Packaging, (23 October 2000); doi: 10.1117/12.404868
Show Author Affiliations
Qingjin Yang, Gintic Institute of Manufacturing Technology (Singapore)
Zhiping Wang, Gintic Institute of Manufacturing Technology (Singapore)
Geok Hian Lim, Nanyang Technological Univ. (Singapore)
Hock Lye John Pang, Nanyang Technological Univ. (Singapore)
Fook Fah Yap, Nanyang Technological Univ. (Singapore)
Rongming Lin, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 4229:
Microelectronic Yield, Reliability, and Advanced Packaging
Cher Ming Tan; Yeng-Kaung Peng; Mali Mahalingam; Krishnamachar Prasad, Editor(s)

© SPIE. Terms of Use
Back to Top