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Proceedings Paper

New 2D to 3D x-ray lithography technology for grayscale structures
Author(s): Vladimir A. Kudryashov; Sing Lee
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Paper Abstract

A new 2D to 3D volumetric technology for gray scale structures production developed originally for e-beam lithography is successfully extended to x-ray lithography. Based on the binary nature of the lithography process, this technology demonstrates much higher process latitude and a possibility of 20 to 40 different height resist structures formation in a relatively thick resist layer. A 2-dimensional binary resist structure with a specially designed topology produced by a constant dose exposure and development can be transformed into a 3- dimensional one by resist reflowing during baking at a temperature higher then the glassing one for this resist.

Paper Details

Date Published: 20 October 2000
PDF: 11 pages
Proc. SPIE 4226, Microlithographic Techniques in Integrated Circuit Fabrication II, (20 October 2000); doi: 10.1117/12.404857
Show Author Affiliations
Vladimir A. Kudryashov, Nanyang Technological Univ. and Institute of Microelectronics (Singapore)
Sing Lee, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 4226:
Microlithographic Techniques in Integrated Circuit Fabrication II
Chris A. Mack; XiaoCong Yuan, Editor(s)

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