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Proceedings Paper

Optimization of the planarizing performance of a DUV organic bottom antireflective coating for via first dual-damascene process: cooperation to achieve material and process characterization
Author(s): Paul Williams; Alice Martin; Marlene Strobl; William R. Roberts; Francis G. Goodwin; Lars Voelkel; Axel Feicke; Sean Trautman; James E. Lamb
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Paper Abstract

The work outlines a solution to the challenge of integrating a planarizing BARC into the via first dual damascene manufacturing process. We report the initial problems encountered in attempting the planarizing process and the resulting investigation into the coating process. We identify the critical parameters relating to the via fill performance of the material which relate not only to the process conditions, but also to the chemical make-up of the BARC. As a direct result of this study, a low molecular weight component within the DUV BARC has been identified which may be the key component to planarizing behavior. Cooperation from both supplier and user was necessary, as the availability of alternative test structures, with equivalent topography/surface chemistry, as device wafers was not possible. This resulted in considerable investment [from the user] of sacrificing product wafers for the analysis of the planarizing performance.

Paper Details

Date Published: 20 October 2000
PDF: 9 pages
Proc. SPIE 4226, Microlithographic Techniques in Integrated Circuit Fabrication II, (20 October 2000); doi: 10.1117/12.404853
Show Author Affiliations
Paul Williams, Brewer Science, Inc. (United States)
Alice Martin, Brewer Science, Inc. (United States)
Marlene Strobl, White Oak Semiconductor (United States)
William R. Roberts, White Oak Semiconductor (United States)
Francis G. Goodwin, White Oak Semiconductor (United States)
Lars Voelkel, Infineon Technologies Dresden GmbH (Germany)
Axel Feicke, Infineon Technologies Dresden GmbH (Germany)
Sean Trautman, Brewer Science, Inc. (United States)
James E. Lamb, Brewer Science, Inc. (United States)


Published in SPIE Proceedings Vol. 4226:
Microlithographic Techniques in Integrated Circuit Fabrication II
Chris A. Mack; XiaoCong Yuan, Editor(s)

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