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Proceedings Paper

Investigation on bridge in QFP and fatigue in BGA based on simulating solder joint formation
Author(s): Xiujuan Zhao; Chunqing Wang; Lei Zhang; Chunyan Yin; Shiqin Yang
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Paper Abstract

The application of Quad Flat Pack (QFP) and Ball Grid Array (BGA) technology in manufacturing of advanced electronic products has been grown significantly during the past several years. QFP and BGA has several advantages over traditional packaging technology in terms of smaller package area, higher I/Os, higher assembly yield, and so on. However, some potential problems of bridge among solder joints in QFP and creep-fatigue failure of solder joints in BGA serving occurs and often results in the failure of products. It has been found that both the bridge in QFP and fatigue failure of solder joints in BGA highly depends on the shape of solder joints. So, in this paper, the mathematical models of simulating the formation of solder joints in QFP and BGA are built based on minimum energy theorem, and the shape of solder joints are predicted. According to the predicted shape, the bridge mechanism in solder joints in QFP and the fatigue failure of solder joints in BGA is investigated.

Paper Details

Date Published: 13 October 2000
PDF: 6 pages
Proc. SPIE 4192, Intelligent Systems in Design and Manufacturing III, (13 October 2000); doi: 10.1117/12.403651
Show Author Affiliations
Xiujuan Zhao, Harbin Institute of Technology (China)
Chunqing Wang, Harbin Institute of Technology (China)
Lei Zhang, Harbin Institute of Technology (China)
Chunyan Yin, Harbin Institute of Technology (China)
Shiqin Yang, Harbin Institute of Technology (China)


Published in SPIE Proceedings Vol. 4192:
Intelligent Systems in Design and Manufacturing III
Bhaskaran Gopalakrishnan; Angappa Gunasekaran, Editor(s)

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