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Proceedings Paper

Microfabrication and packaging of deformable mirror devices
Author(s): Alan W.S. Ross; Stephen C. Graham; Alan M. Gundlach; J. Tom M. Stevenson; William J. Hossack; David G. Vass; Georg K.H. Bodammer; Euan Smith; Kevin Ward
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Paper Abstract

We describe the fabrication and testing of deformable membrane mirrors over silicon backplanes using our in-house CMOS processing facilities. The fabrication of dense arrays of electrostatic actuators on the backplane potentially allows fine control of the membrane surface shape than can be produced when using a printed circuit board as the backplane. We presents a range of techniques for fabrication the membrane mirrors in various materials and mating the structure to a silicon backplane. We characterise membrane deflection with electric field for silicon nitride and polymer membranes over a passive silicon backplane consisting of 37 directly-addressed electrode pads configured in a hexagonal array.

Paper Details

Date Published: 1 September 2000
PDF: 8 pages
Proc. SPIE 4075, Micro-Opto-Electro-Mechanical Systems, (1 September 2000); doi: 10.1117/12.397934
Show Author Affiliations
Alan W.S. Ross, Univ. of Edinburgh (United Kingdom)
Stephen C. Graham, Univ. of Edinburgh (United Kingdom)
Alan M. Gundlach, Univ. of Edinburgh (United Kingdom)
J. Tom M. Stevenson, Univ. of Edinburgh (United Kingdom)
William J. Hossack, Univ. of Edinburgh (United Kingdom)
David G. Vass, Univ. of Edinburgh (United Kingdom)
Georg K.H. Bodammer, Univ. of Edinburgh (United Kingdom)
Euan Smith, Spectron Laser Optics (United Kingdom)
Kevin Ward, Laporte Electronics (United Kingdom)


Published in SPIE Proceedings Vol. 4075:
Micro-Opto-Electro-Mechanical Systems

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