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Proceedings Paper

Fabrication and packaging of optical components and microsystems
Author(s): Juha T. Rantala; Janne K. Aikio; Pentti Karioja; Michael R. Descour; Harri K. Kopola; Jorma Lammasniemi
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Paper Abstract

The paper reports on methods to fabricate novel materials and associated processing for optoelectronics and optical structures compatible with manufacturing of microsystems. Furthermore, the paper presents results on designing, fabrication and packaging of different modules and microsystems for sensor, instrumentation and optical communication applications. New materials are developed and liquid phase deposition methods are applied for the fabrication of lithography compatible glasses, conducive transparent glasses and protective materials. The developed lithographic glasses are used for example to fabricate micro-opto-mechanical structures. By using these materials and structures, a miniaturized micro-optical table is constructed. Furthermore, organic and hybrid semiconductors and light emitting materials are manufactured and their integration as micro-optical components and systems are described. From the view-point of module integration, a wavelength tunable laser diode, i.e., a MOEMS consisting of laser diode and a silicon micromachined Fabry-Perot interferometer, is demonstrated and modeled. A ~4nm wavelength tuning range with ~0.3nm FWHM spectral width is experimentally obtained at 980 nm. Moreover, the use of a passive alignment structure for the fiber pigtailing of a multimode laser diode is demonstrated. The ceramic alignment structure is hot embossed with a LIGA machined tool and results in a ~56% coupling efficiency, corresponding to the theoretical maximum.

Paper Details

Date Published: 1 September 2000
PDF: 10 pages
Proc. SPIE 4075, Micro-Opto-Electro-Mechanical Systems, (1 September 2000); doi: 10.1117/12.397926
Show Author Affiliations
Juha T. Rantala, VTT Electronics (Finland)
Janne K. Aikio, VTT Electronics (Finland)
Pentti Karioja, VTT Electronics (Finland)
Michael R. Descour, Optical Sciences Ctr./Univ. of Arizona (United States)
Harri K. Kopola, VTT Electronics (Finland)
Jorma Lammasniemi, VTT Electronics (Finland)


Published in SPIE Proceedings Vol. 4075:
Micro-Opto-Electro-Mechanical Systems
Richard R. A. Syms, Editor(s)

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