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Proceedings Paper

Micromachining in silicon for passive alignment of optical fibers
Author(s): Ylva Baecklund
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Paper Abstract

High precision and passive alignment of opto devices is of great important in order to reduce assembling costs in hybrid micro systems. Silicon micromachining is suitable in this aspect since it enables the fabrication of high precision structures. This paper will present both generic results conserning high precision silicon micromachining as well as applications in form of fibre alignment structures and chip mounting with interconnects on a silicon substrate. Firstly, ways of producing 45 degree(s) slanted walls in silicon for light reflection are presented. Secondly, flexible clamping structures for holding opto fibres into v- grooves are discussed, both bulk and surface micromachined. These holding structures facilitate the mounting of optical fibres. Finally, a technique for chip mounting and interconnects on a silicon substrate is presented where chips are placed in etched pits and photo patterned BCB is used as dielectrica.

Paper Details

Date Published: 1 September 2000
PDF: 6 pages
Proc. SPIE 4075, Micro-Opto-Electro-Mechanical Systems, (1 September 2000); doi: 10.1117/12.397923
Show Author Affiliations
Ylva Baecklund, Uppsala Univ. (Sweden)


Published in SPIE Proceedings Vol. 4075:
Micro-Opto-Electro-Mechanical Systems
Richard R. A. Syms, Editor(s)

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