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Novel aspects of interferometric testing of silicon microelement properties
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Paper Abstract

In the paper the problems connected with analysis of mechanical properties of silicon microelements being basic part of MEMS are discussed. The quality of these microproducts is strongly depended on the material properties, mechanical design and on technology process. The best-suited methods for their testing are optical full-field measuring methods. In this paper two types of interferometers specially suited for microelements testing are presented: The first type, based on the concept of waveguide grating interferometer for in-plane displacement measurement, is designed for small size field of view (0.18 x 0.12 mm2). It is integrated with a standard optical microscope and it seems to be an excellent tool for local material studies and strain analysis of microcomponents. It includes also miniature Twyman-Green interferometer, which allows measuring out-of- plane displacements. The waveguide interferometer presented requires the specimen grating integrated with element under test. The second type, digital holographic interferometer for shape deformation measurement, is used for testing of elements with rough surface. It overcomes several drawbacks of conventional holography by storing the hologram directly in the computer using a CCD matrix as optical sensor. The applications of these instruments are shown on examples of Young's modulus determination in microbeams, 3-D displacements determination in laser diode array during its technological process and shape deformation analysis of pressure sensor micromembrane.

Paper Details

Date Published: 1 September 2000
PDF: 8 pages
Proc. SPIE 4075, Micro-Opto-Electro-Mechanical Systems, (1 September 2000); doi: 10.1117/12.397922
Show Author Affiliations
Leszek A. Salbut, Warsaw Univ. of Technology (Poland)
Michal Jozwik, Warsaw Univ. of Technology (France)

Published in SPIE Proceedings Vol. 4075:
Micro-Opto-Electro-Mechanical Systems
Richard R. A. Syms, Editor(s)

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