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Proceedings Paper

Development of modules for micro-optical integration and MOEMS packaging
Author(s): Karl-Heinz Brenner
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Paper Abstract

For the transfer of micro optical and mechanical components to an application, packaging currently represents a major problem. The electrical, optical and mechanical components are typically fabricated with lithographic techniques. Thus the relative distances are accurate, but the absolute position on the substrate is defined by the quality of the separation tool. Thus active alignment is usually necessary for the assembly. For the development of standardized MOEM - modules, designed to eliminate the problems of alignment, technological, optical and function considerations have to be addressed.

Paper Details

Date Published: 22 August 2000
PDF: 3 pages
Proc. SPIE 4178, MOEMS and Miniaturized Systems, (22 August 2000); doi: 10.1117/12.396481
Show Author Affiliations
Karl-Heinz Brenner, Univ. of Mannheim (Germany)

Published in SPIE Proceedings Vol. 4178:
MOEMS and Miniaturized Systems
M. Edward Motamedi; Rolf Goering, Editor(s)

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