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Proceedings Paper

High-aspect-ratio microstructure fabrication using SU-8 resist
Author(s): Jun Zhu; Xiaolin Zhao; Zhiping Ni
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Paper Abstract

The SU-8 series is a negative, epoxy-type, near-UV photoresist. It has good light sensitivity and can be structured to more than 2 mm in thickness by UV exposure. It is very suitable for the application in MEMS, UV-LIGA, ultra-film. Fast prototyped from the SU-8 microstructure is a very simple way to manufacture high aspect ratio micromechanical components. The cost of this process is much lower than that of the LIGA process. We adopted electroplating method to prototype SU-8. So metallic film needed to be sputtered on the surface of the silicon wafer. IN order to study the adhesive strength between different metallic films and the SU-8, we prepared four substrates with Cu, NiFe, Au, and Ti film respectively. We found the Ti film has the strongest adhesive strength with the resist. When the film is FeNi, we should decrease the exposure duration to obtain good adhesive strength, due to the strong refection of the film.

Paper Details

Date Published: 25 August 2000
PDF: 4 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396472
Show Author Affiliations
Jun Zhu, Shanghai Jiao Tong Univ. (China)
Xiaolin Zhao, Shanghai Jiao Tong Univ. (China)
Zhiping Ni, Shanghai Jiao Tong Univ. (China)


Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

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