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Proceedings Paper

Single-crystal micromachining using multiple fusion-bonded layers
Author(s): Alan Brown; Garry O'Neill; Scott C. Blackstone
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Paper Abstract

Multi-layer structures have been fabricated using Fusion bonding. The paper shows void free layers of between 2 and 100 microns that have been bonded to form multi-layer structures. Silicon layers have been bonded both with and without interfacial oxide layers.

Paper Details

Date Published: 25 August 2000
PDF: 10 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396460
Show Author Affiliations
Alan Brown, BCO Technologies (NI) Ltd. (United Kingdom)
Garry O'Neill, BCO Technologies (NI) Ltd. (Ireland)
Scott C. Blackstone, BCO America (United States)

Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

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