Share Email Print
cover

Proceedings Paper

Wafer-level chip size package with an air cavity above the active surface for micromechanical applications
Author(s): Avner P. Badihi
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

While package developers struggle to keep pace with the shrinking I/O pitch of the latest ICS, another challenge is being added by a new wave of micro-electro-mechanical systems. These devices combine standard IC circuitry with micro-moving silicon structures.

Paper Details

Date Published: 25 August 2000
PDF: 6 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396456
Show Author Affiliations
Avner P. Badihi, ShellCase Ltd. (Israel)


Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

© SPIE. Terms of Use
Back to Top