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Proceedings Paper

Wafer-level chip size package with an air cavity above the active surface for micromechanical applications
Author(s): Avner P. Badihi
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Paper Abstract

While package developers struggle to keep pace with the shrinking I/O pitch of the latest ICS, another challenge is being added by a new wave of micro-electro-mechanical systems. These devices combine standard IC circuitry with micro-moving silicon structures.

Paper Details

Date Published: 25 August 2000
PDF: 6 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396456
Show Author Affiliations
Avner P. Badihi, ShellCase Ltd. (Israel)

Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

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