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Proceedings Paper

Novel low-temperature pressure-assisted bonding technology
Author(s): Abdeljlail Sayah; Dominique Solignac; Martin A. M. Gijs
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Paper Abstract

We introduce a new low temperature bonding technology to assemble two microstructured glass substrates for the realization of micro channels for chemical analysis applications. To realize the micro channels, we introduce, besides the well-known HF-etching technology, two simple alternative methods, namely sawing and micro-powder blasting. After proper cleaning of the two glass surfaces, direct bonding is obtained just by exposing the glass stack to a high pressure in the 100-200 degrees C temperature range. At these low temperatures, we obtain bonding strengths as high as 10 MPA, comparable to the best values reported in literature. As a possible mechanisms for this strong bonding, we propose the pressure-induced enhancement of the bonding contact surface.

Paper Details

Date Published: 25 August 2000
PDF: 8 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396455
Show Author Affiliations
Abdeljlail Sayah, Swiss Federal Institute of Technology Lausanne (Switzerland)
Dominique Solignac, Swiss Federal Institute of Technology Lausanne (Switzerland)
Martin A. M. Gijs, Swiss Federal Institute of Technology Lausanne (Switzerland)


Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

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