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Proceedings Paper

Experimental study of micro-EDM machining performances on silicon wafer
Author(s): Xiaozhong Song; Wim Meeusen; Dominiek Reynaerts; Hendrik Van Brussel
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Paper Abstract

The micro-EDM silicon machining performances have been stud on a highly doped P-type silicon wafer. To demonstrate and to emphasize the silicon micro-EDM, one kind of stainless steel is machine das a reference material. Both materials are sparked with specific sparking energy in micro-Joule energy range and machining characteristics such as material removal mechanism, cutting rate, relative electrode wear ratio and surface quality are examined and analyzed. The thermally induced microcracks are also examined and analyzed using a an optical and a SEM. It is found that for silicon, the micro-EDM material removal mechanism is not completely similar to conventional metal micro-EDM; besides melting and evaporation there is a significant contribution from thermal spallation, which is a kind of direct mechanical material damage without melting. This paper also present that microcrack generation is not only relate to the sparking energy but also has a close relationship with the silicon crystal lattice. In order to get microcrack free silicon surfaces, the sparking energy should be controlled to low levels, which are much lower than the voltage levels used in metal micro-EDM. All in all, thermal spalling should be reduced as much as possible, to obtain smooth and crack free machined surfaces.

Paper Details

Date Published: 25 August 2000
PDF: 9 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396450
Show Author Affiliations
Xiaozhong Song, Katholieke Univ. Leuven (Belgium)
Wim Meeusen, Katholieke Univ. Leuven (Belgium)
Dominiek Reynaerts, Katholieke Univ. Leuven (Belgium)
Hendrik Van Brussel, Katholieke Univ. Leuven (Belgium)


Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

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