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Proceedings Paper

Laser microwelding in electronics: limitations and solutions for a further miniaturization
Author(s): Michael Hubert Marcus Schmidt; Andreas Otto
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Paper Abstract

Looking at today's production of microelectronics, the laser is a commonly used tool for many purposes. Especially laser micro welding of electronic contacts, the application discussed here, gains more and more importance in industrial production. The reasons are its high flexibility, the absence of a third joining partner like solder, the high temperature resistance and finally its high miniaturization potential.

Paper Details

Date Published: 25 August 2000
PDF: 10 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396439
Show Author Affiliations
Michael Hubert Marcus Schmidt, Friedrich-Alexander Univ. Erlangen-Nuremberg (Germany)
Andreas Otto, Friedrich-Alexander Univ. Erlangen-Nuremberg (Germany)

Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

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