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Proceedings Paper

Large-area MEMS fabrication with thick SU-8 photoresist applied to an x-ray image sensor array
Author(s): Jurgen H. Daniel; Brent S. Krusor; Raj B. Apte; Robert A. Street; Adela Goredema; Jason McCallum; Daniele C. Boils-Boissier; Peter M. Kazmaier
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Paper Abstract

MEMS fabrication on large area substrates is promising for novel system concepts, but processes based on crystalline silicon cannot be used. Polymeric materials such as the thick photoresist SU-8 are more appropriate for this purpose because their processing can be scaled to large areas. An x- ray image sensor array based on amorphous silicon on glass substrates was taken as an examples to apply the SU-8 microfabrication technique. We anticipate an improved performance of the imager. The resolution of the x-ray imager is expected to increase by patterning the x-ray conversion screen into cells, which match the sensor pixels of the imager, and SU-8 defines these cells. Furthermore, SU-8 functions as a thick interlayer dielectric with decrease the electronic noise and result in a higher sensitivity of the imager. The fabrication process with SU-8 will be described and challenging issues, especially when considering large area substrates, will be discussed.

Paper Details

Date Published: 25 August 2000
PDF: 9 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396431
Show Author Affiliations
Jurgen H. Daniel, Xerox Palo Alto Research Ctr. (United States)
Brent S. Krusor, Xerox Palo Alto Research Ctr. (United States)
Raj B. Apte, Xerox Palo Alto Research Ctr. (United States)
Robert A. Street, Xerox Palo Alto Research Ctr. (United States)
Adela Goredema, Xerox Research Ctr. Canada (Canada)
Jason McCallum, Xerox Research Ctr. Canada (Canada)
Daniele C. Boils-Boissier, Xerox Research Ctr. Canada (Canada)
Peter M. Kazmaier, Xerox Research Ctr. Canada (Canada)


Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

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