Share Email Print
cover

Proceedings Paper

SOI micromachining technologies for MEMS
Author(s): Stephane Renard
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The industrial use of SOI substrates is quickly spreading. For microelectronics applications, this material brings new functionality such as radiation-hard, high voltage or low voltage and low consumption integrated circuits. Industrial wafers are now commercially available and new technologies, such as Smart Cut from SOITEC company, will provide low price in high volume production. SOI brings also very important features in MEMS. TRONICS Microsystems, a manufacturer of customers specific MEMS on Surface and bulk micromachining produces MEMS components, such as high temperature and low noise piezo resistive pressure sensor or miniature high performances capacitive pressure and acceleration sensors, using SOI wafers. One of the process used: the Epi-SOI surface micromachining has become a new generic technology that will provide various industrial products in the near future.

Paper Details

Date Published: 25 August 2000
PDF: 7 pages
Proc. SPIE 4174, Micromachining and Microfabrication Process Technology VI, (25 August 2000); doi: 10.1117/12.396430
Show Author Affiliations
Stephane Renard, TRONIC'S Microsystems (France)


Published in SPIE Proceedings Vol. 4174:
Micromachining and Microfabrication Process Technology VI
Jean Michel Karam; John A. Yasaitis, Editor(s)

© SPIE. Terms of Use
Back to Top