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Proceedings Paper

Low-energy neutral processing and process characterization
Author(s): Xianmin Tang; Dennis M. Manos; Qi Wang; Chris A. Nichols
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Paper Abstract

The purpose of this paper is to present a novel charge-free processing method which could be integrated for future generation feature production. The source reported here is a surface- reflection neutralization based inductively coupled plasma sources. Experiments and simulations how that his source can produce enough low energy fast neutrals for ashing applications. The cleaning efficiency and stripping rates are characterized as a function of operating parameters. Measurements using a heat flux and momentum analyzer show the neutral flux is on the order 1015 cm-2s-1 and the neutral energy is tunable between 3-6 eV. Process damage assessment by various plasma processes, such as continuous vs. pulsed plasmas, has been included in this paper. These results demonstrate this source is promising for development soft-landing steps suitable for fragile features.

Paper Details

Date Published: 18 August 2000
PDF: 11 pages
Proc. SPIE 4181, Challenges in Process Integration and Device Technology, (18 August 2000); doi: 10.1117/12.395746
Show Author Affiliations
Xianmin Tang, College of William and Mary (United States)
Dennis M. Manos, College of William and Mary (United States)
Qi Wang, Keithley Instruments, Inc. (United States)
Chris A. Nichols, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 4181:
Challenges in Process Integration and Device Technology
David Burnett; Shin'ichiro Kimura; Bhanwar Singh, Editor(s)

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