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Proceedings Paper

Is lithography ready for 300 mm?
Author(s): Alain B. Charles; Clint Haris; Steffen R. Hornig; Dietmar Ganz; Thorsten Schedel; Guenther Hraschan; Wolfram Koestler; John G. Maltabes; Karl E. Mautz; Sebastian Schmidt; Ralf Schuster
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Paper Abstract

SEMICONDUCTOR300 was the first pilot production facility for 300mm wafers in the world. This company, a joint venture between Infineon Technologies Motorola, started in early 1998 to develop processes and manufacture products using 300mm wafer tool set. The lithography tools include I-line steppers, as I-line scanner, a DUV stepper, and DUV scanners. All of these exposure tools are running in-line with a photoresist coat and develop track. The lithography tools are used to build 64Mb DRAM devices and aggressive test vehicles with design rules of 0.25 micrometers and below, in sufficient quantity to be able to assess the tool readiness. This paper present the history of technical improvements and roadblocks that have occurred on the 300mm lithography tool set since the start-up, and describe a methodology used to assess the tool performance.

Paper Details

Date Published: 18 August 2000
PDF: 11 pages
Proc. SPIE 4181, Challenges in Process Integration and Device Technology, (18 August 2000); doi: 10.1117/12.395736
Show Author Affiliations
Alain B. Charles, Semiconductor300 GmbH & Co. KG (Germany)
Clint Haris, Semiconductor300 GmbH & Co. KG (Germany)
Steffen R. Hornig, Semiconductor300 GmbH & Co. KG (Germany)
Dietmar Ganz, Semiconductor300 GmbH & Co. KG (Germany)
Thorsten Schedel, Semiconductor300 GmbH & Co. KG (Germany)
Guenther Hraschan, Semiconductor300 GmbH & Co. KG (Germany)
Wolfram Koestler, Semiconductor300 GmbH & Co. KG (Germany)
John G. Maltabes, Semiconductor300 GmbH & Co. KG (United States)
Karl E. Mautz, Semiconductor300 GmbH & Co. KG (United States)
Sebastian Schmidt, Semiconductor300 GmbH & Co. KG (Germany)
Ralf Schuster, Semiconductor300 GmbH & Co. KG (Germany)


Published in SPIE Proceedings Vol. 4181:
Challenges in Process Integration and Device Technology
David Burnett; Shin'ichiro Kimura; Bhanwar Singh, Editor(s)

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