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Proceedings Paper

Effects of temperature on surface adhesion in MEMS structures
Author(s): Jeffrey M. Jennings; Leslie M. Phinney
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Paper Abstract

Techniques to predict the reliability of microdevices are necessary to facilitate the transfer of MEMS designs from the laboratory to the marketplace. An important reliability concern for microfabricated structures is in-use stiction, the operational failure of devices due to surface adhesion. The current study determines the temperature dependence of in-use stiction for polyscrystalline silicon microcantilevers subjected to three different release conditions: supercritical CO2 drying; laser-irradiation repair; and self- assembled monolayer post processing. The microcantilever beam arrays were electrostatically actuated at temperatures between 22$DEGC and 300$DEGC. The supercritical CO2 dried devices showed an overall decrease in sticking probability as the actuation temperature was raised to 300$DEGC. After a distinct improvement in the failure rate between the first and second actuation temperatures, arrays released using laser-irradiation did not exhibit a consistent trend. Samples coated with an OTS monolayer had large increases in their sticking probability as the temperature was raised. However, at temperatures above 200$DEGC, a decrease in in-use stiction was observed which continued through most of the cooling cycle.

Paper Details

Date Published: 10 August 2000
PDF: 10 pages
Proc. SPIE 4180, MEMS Reliability for Critical Applications, (10 August 2000); doi: 10.1117/12.395710
Show Author Affiliations
Jeffrey M. Jennings, Univ. of Illinois/Urbana-Champaign (United States)
Leslie M. Phinney, Univ. of Illinois/Urbana-Champaign (United States)


Published in SPIE Proceedings Vol. 4180:
MEMS Reliability for Critical Applications
Russell A. Lawton, Editor(s)

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