Share Email Print

Proceedings Paper

Failure analysis of tungsten-coated polysilicon micromachined microengines
Author(s): Jeremy A. Walraven; Seethambal S. Mani; James G. Fleming; Thomas J. Headley; Paul G. Kotula; Alejandro A. Pimentel; Michael J. Rye; Danelle M. Tanner; Norman F. Smith
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Failure analysis (FA) tools have been applied to analyze tungsten coated polysilicon microengines. These devices were stressed under accelerated conditions at ambient temperatures and pressure. Preliminary results illustrating the failure modes of microengines operated under variable humidity and ultra-high drive frequency will also be shown. Analysis os tungsten coated microengines revealed the absence of wear debris in microengines operated under ambient conditions. Plan view imagine of these microengines using scanning electron microscopy (SEM) revealed no accumulation of wear debris on the surface of the gears or ground plane on microengines operated under standard laboratory conditions. Friction bearing surfaces were exposed and analyzed using the focused ion beam (FIB). These cross sections revealed no accumulation of debris along friction bear surfaces. By using transmission electro microscopy (TEM) in conjunction with electron energy loss spectroscopy (EELS), we were able to identify the thickness, elemental analysis, and crystallographic properties of tungsten coated MEMS devices. Atomic force microscopy was also utilized to analyze the surface roughness of friction bearing surfaces.

Paper Details

Date Published: 10 August 2000
PDF: 9 pages
Proc. SPIE 4180, MEMS Reliability for Critical Applications, (10 August 2000); doi: 10.1117/12.395708
Show Author Affiliations
Jeremy A. Walraven, Sandia National Labs. (United States)
Seethambal S. Mani, Sandia National Labs. (United States)
James G. Fleming, Sandia National Labs. (United States)
Thomas J. Headley, Sandia National Labs. (United States)
Paul G. Kotula, Sandia National Labs. (United States)
Alejandro A. Pimentel, Sandia National Labs. (United States)
Michael J. Rye, Sandia National Labs. (United States)
Danelle M. Tanner, Sandia National Labs. (United States)
Norman F. Smith, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 4180:
MEMS Reliability for Critical Applications
Russell A. Lawton, Editor(s)

© SPIE. Terms of Use
Back to Top