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Proceedings Paper

Fracture tests of etched components using a focused ion beam machine
Author(s): Jonathan L. Kuhn; Rainer K. Fettig; Samuel Harvey Moseley; Alexander S. Kutyrev; Jon Orloff
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Paper Abstract

Many optical MEMS device designs involve large arrays of thin (0.5 to 1 (mu) m) components subjected to high stresses due to cyclic loading. These devices are fabricated from a variety of materials, and the properties strongly depend on size and processing. Our objective is to develop standard and convenient test methods that can be used to measure the properties of large numbers of witness samples, for every device we build. In this work we explore a variety of fracture tests configurations for 0.5 (mu) m thick silicon nitride membranes machined using the Reactive Ion Etching (RIE) process. Testing was completed using an FEI 620 dual focused ion beam milling machine. Static loads were applied using a probe, and dynamic loads were applied through a piezo-electric stack mounted at the base of the probe. Results from the tests are presented and compared, and application for predicting fracture probability of large arrays of devices are considered.

Paper Details

Date Published: 10 August 2000
PDF: 9 pages
Proc. SPIE 4180, MEMS Reliability for Critical Applications, (10 August 2000); doi: 10.1117/12.395707
Show Author Affiliations
Jonathan L. Kuhn, NASA Goddard Space Flight Ctr. (United States)
Rainer K. Fettig, Raytheon ITSS (United States)
Samuel Harvey Moseley, NASA Goddard Space Flight Ctr. (United States)
Alexander S. Kutyrev, Raytheon ITSS (United States)
Jon Orloff, Univ. of Maryland/College Park (United States)


Published in SPIE Proceedings Vol. 4180:
MEMS Reliability for Critical Applications
Russell A. Lawton, Editor(s)

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