Share Email Print

Proceedings Paper

Polymer UV-molding for micro-optical systems and O/E-integration
Author(s): Peter Dannberg; Gunnar Mann; Lars Wagner; Andreas H. Braeuer
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The potential and limits of micromoulding technology for the wafer scale hybrid integration of micro-optic elements on top of arbitrary substrates like glass, Silicon, III/V-semiconductors by a process which is performed in a modified contact mask aligner. The elements are characterised by high precision and stability, temperature stable and precise pitch, index, homogeneity, uniformity across the wafer, and they fulfill additional requirements for a practical application (AR-coating, separation in a dicing saw). Additionally, the technology for a two- sided replication of elements has been developed. The precision of lens arrays fabricated by reflow and UV-moulding is investigated, and the high performance of these arrays in the collimation of fiber arrays is shown. Steps toward a wafer scale integration of lens arrays with vertical cavity surface emitting lasers (VCSELs) by locally selective replication are demonstrated.

Paper Details

Date Published: 18 August 2000
PDF: 9 pages
Proc. SPIE 4179, Micromachining Technology for Micro-Optics, (18 August 2000); doi: 10.1117/12.395684
Show Author Affiliations
Peter Dannberg, Fraunhofer-Institut fuer Angewandte Optik & Feinmechanik (Germany)
Gunnar Mann, Fraunhofer-Institut fuer Angewandte Optik & Feinmechanik (Germany)
Lars Wagner, Fraunhofer-Institut fuer Angewandte Optik & Feinmechanik (Germany)
Andreas H. Braeuer, Fraunhofer-Institut fuer Angewandte Optik & Feinmechanik (Germany)

Published in SPIE Proceedings Vol. 4179:
Micromachining Technology for Micro-Optics
Sing H. Lee; Eric G. Johnson, Editor(s)

© SPIE. Terms of Use
Back to Top