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Proceedings Paper

Dual beam-mass structure gyroscope micromachined by deep RIE process
Author(s): Heng Yang; Minhang Bao; Hao Yin; Shaoqun Shen
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Paper Abstract

Described in this paper is a micromachined vibratory gyroscope fabricated by combining anisotropic etching and DRIE process. The gyro consists of two chips, the sensor chip and the bottom chip. Two identical cantilever beam-mass structures are fabricated in the sensor chip and driving electrodes are made on the bottom chip. The beam-mass structure has two vibration modes: the vertical vibration mode for driving and the lateral vibration mode for sensing. Piezoresistive sensing elements are made on the surface of the beams to monitor the vertical and the lateral vibration. Gyroscopes can be formed using a single beam-mass structure or using two beam-mass structures (the dual beam-mass gyroscope). The effect of acceleration can be rejected if a differential operation mode is used for a dual beam-mass gyroscope. The gyroscope can operate in an atmospheric pressure due to the high Q value in lateral vibration mode dominated by slide-film air damping. Piezoresistive sensing avoids the difficulties caused by small capacitance detection. The packaging and testing costs can be reduced significantly. Preliminary results for a working device with a single beam-mass structure show that the sensitivity for angular rate signal is found to be about 15.6(mu) V/$DEG/sec/5V in an atmospheric pressure environment.

Paper Details

Date Published: 15 August 2000
PDF: 8 pages
Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); doi: 10.1117/12.395642
Show Author Affiliations
Heng Yang, Fudan Univ. (Netherlands)
Minhang Bao, Fudan Univ. (China)
Hao Yin, Fudan Univ. (China)
Shaoqun Shen, Fudan Univ. (China)

Published in SPIE Proceedings Vol. 4176:
Micromachined Devices and Components VI
Eric Peeters; Oliver Paul, Editor(s)

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