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Proceedings Paper

High-force 10-kN piezoresistive silicon force sensor with output independent of force distribution
Author(s): Robert A.F. Zwijze; Remeo J. Wiegerink; G. J. M. Krijnen; J. W. Berenschot; Meint J. de Boer; Miko C. Elwenspoek
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Paper Abstract

A 10kN silicon force sensor is realized in which the force is measured by compressing a meander shaped polysilicon strain gage. A second gage which is not loaded, is used for temperature compensation, for compensation of bending and stretching stresses in the chip and for common changes in zero load resistor values. It is shown that the output of the bridge is a linear function of the force and is independent of the force distribution on the chip. By measuring the resistance change along both gages, the force distribution on the chip can be determined so that it can be detected whether the sensor has an oblique load or not. The production process of the chip is simple and robust. A package is designed to apply the load. Hysteresis experiments are performed at four temperatures between 25 $DEGC and 49 $DEGC. Hysteresis measurements at room temperature are in close agreement with finite element calculations. The maximum hysteresis error is within +/- 0.14% of the fill-scale output (fso). Creep was tested by loading it five times. It follows that creep is smaller than 0.01% of the fso. The total error including interpolation error is within +/- 0.23%.

Paper Details

Date Published: 15 August 2000
PDF: 12 pages
Proc. SPIE 4176, Micromachined Devices and Components VI, (15 August 2000); doi: 10.1117/12.395640
Show Author Affiliations
Robert A.F. Zwijze, Univ. of Twente (Netherlands)
Remeo J. Wiegerink, Univ. of Twente (Netherlands)
G. J. M. Krijnen, Univ. of Twente (Netherlands)
J. W. Berenschot, Univ. of Twente (Netherlands)
Meint J. de Boer, Univ. of Twente (Netherlands)
Miko C. Elwenspoek, Univ. of Twente (Netherlands)


Published in SPIE Proceedings Vol. 4176:
Micromachined Devices and Components VI
Eric Peeters; Oliver Paul, Editor(s)

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